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Material H LKT 5029 point 01 Conductive putty component I plus Conductive putty component IV,Material H LKT 5029 point 02 Conductive putty component II plus Conductive putty component III,Wet Insulation Tape H FG2G 1007 point 04 and 0 point 19X25 MM Standard IGL1007,Wet Insulation Cover Tape H GSbD 2202 and 0 point 1X25 MM Standard 2202,Wet Insulation Resin Component I H EPZ 5009 point 01 according to 5009 Standard IGL5009,Wet Insulation Resin Component II H EPZ 5009 point 02 according to 5009 Standard IGL5009,Lacing of T Blocks H SCHL 2206 point 02 dia 7 point 5mm IGL 2206 Standard IGL2206

Ministry of Power › SJVN Limited

GeMGovernment e-Marketplace (GeM)GeMOpen for bids
OrganisationMinistry of Power
DepartmentSJVN Limited
Tender valueNot stated by the portal
EMDNot stated by the portal
Last date for bids17 Nov 2026, 07:30 pm (open)
Published21 Oct 2026
Tender typeBid
CategoryGeM / Material H LKT 5029 point 01 Conductive putty component I plus Conductive putty component IV,Materi
SourceGovernment e-Marketplace (GeM)
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