Thermal Insulation Enclosure Assembly,Precision Front Closure Assembly,Heat Barrier Composite Assembly,Modular Internal Storage Assembly,Secure Access Hardware Assembly
Ministry of Finance › Department of Financial Services
GeMGovernment e-Marketplace (GeM)GeMOpen for bids
| Organisation | Ministry of Finance |
|---|---|
| Department | Department of Financial Services |
| Tender value | Not stated by the portal |
| EMD | Not stated by the portal |
| Last date for bids | 09 Nov 2026, 10:30 pm (open) |
| Published | 30 Oct 2026 |
| Tender type | Bid |
| Category | GeM / Thermal Insulation Enclosure Assembly,Precision Front Closure Assembly,Heat Barrier Composite Assem |
| Source | Government e-Marketplace (GeM) |
Tender ID / NIT, tender fee, inviting authority, contacts, documents and the portal link are for businesses onboarded on QuantProc Sourcing (free).
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